IPC-HDBK-001　Handbook and Guide to the Requirement for Soldered Electrical and Electronic Assemblies to Supplement ANSI/J-STD-001B 已焊接電子組裝件的要求手冊(cè)與導(dǎo)則
J-STD-001D　Requirements for Soldered Electrical & Electronic Assemblies 電氣與電子組裝件錫焊要求
J-STD-002B Solderability Tests for Component Leads,Terminations,Lugs,Terminals and Wires 元件引線、端子、焊片、接線柱及導(dǎo)線可焊性試驗(yàn)
J-STD-003A Solderability Test for Printed Boards 印制板可焊性試驗(yàn)
J-STD-004A Requirements for Soldering Fluxes錫焊焊劑要求
J-STD-005 Requirements for Soldering Pastes 焊膏技術(shù)要求
J-STD-006A Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for electronic Soldering Applications
J-STD-012 Implementation of flip chip and chip scale technology 倒裝芯片及芯片級(jí)封裝技術(shù)的應(yīng)用
J-STD-013 Implementation of Ball Grid Array & Other High Density Technology 球柵陣列(BGA)及其它高密度封裝技術(shù)的應(yīng)用(1996-07)
J-STD-020C Moisture/Reflow Sensitivity classification for Non-Hermetic Solid State Surface Mount Devices 非密封固態(tài)表面貼裝器件濕度/再流焊敏感度分類
J-STD-026 Semiconductor Design Standard for Flip Chip Applications 倒裝芯片用印制板設(shè)計(jì)標(biāo)準(zhǔn)
J-STD-027 Mechanical Outline Standard for Flip Chip and Chip Size Configurations
J-STD-028 Performance Standard for Construction of Flip Chip and Chip Scale Bumps 倒裝芯片及芯片凸塊結(jié)構(gòu)的性能標(biāo)準(zhǔn)
J-STD-032 Performance Standard for Ball Grid Array Balls 球珊陣列性能標(biāo)準(zhǔn)
J-STD-033A Standard for Handling Packing Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices 對(duì)濕度、再流焊敏感表貼裝器件的處置、包裝、發(fā)運(yùn)和使用
J-STD-035 Acoustic Microscopy for Non-Hermetic Encapsulated Electronic Components 非氣密封裝電子元件用聲波顯微鏡(1999-04)

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