【產(chǎn)通社，10月18日訊】史恩希半導(dǎo)體（SMSC；NASDAQ: SMSC）官網(wǎng)消息，其已經(jīng)將片內(nèi)連接（Inter-Chip Connectivity，ICC）專利技術(shù)授權(quán)給三星電子公司（Samsung Electronics Co., Ltd）。

ICC專利技術(shù)已成為數(shù)十億臺(tái)電子設(shè)備的標(biāo)準(zhǔn)USB 2.0協(xié)議，能僅以傳統(tǒng)USB 2.0模擬接口一小部分的功率進(jìn)行短距離傳輸，但同時(shí)仍保持模擬USB 2.0連接的大部分軟件兼容性。高速互連（HSIC）規(guī)范（此為USB 2.0規(guī)范的補(bǔ)充）已將ICC技術(shù)納入其中。在適用情況下，例如便攜式應(yīng)用等，相較于模擬USB 2.0接口，ICC技術(shù)能減少功耗與芯片面積。

通過從SMSC取得的ICC技術(shù)授權(quán)，三星能同時(shí)針對(duì)USB 2.0主機(jī)（host）和USB 2.0設(shè)備（device）的應(yīng)用，開發(fā)出符合HSIC規(guī)范的器件。查詢進(jìn)一步信息，請(qǐng)?jiān)L問http://www.smsc.com/index.php?tid=74。

About SMSC's ICC Technology

SMSC's ICC technology is described in U.S. Patent No. 7,702,832, which was issued to SMSC on April 20, 2010. Additional related patent applications have been filed by SMSC in the United States and other countries. As provided for in the appropriate agreements, USB 2.0 promoters and companies that have timely signed both the USB 2.0 Adopters Agreement and a related HSIC amendment letter may license SMSC's ICC technology patents under reasonable and non-discriminatory (RAND) terms. Further, SMSC's ICC technology is now available to the industry at large through individually negotiated patent licenses from SMSC. For information about licensing SMSC's patented ICC technology, please visit http://www.smsc.com/icc.